Careers
Semiconductor Packaging Engineer
We are building the future of nanoscale imaging.
We design, manufacture and sell the world’s fastest and most intuitive atomic force microscopes. Our instruments enable scientists and engineers to make their next discoveries faster and accelerate technological progress. We have systems in over 40 countries.
(What’s AFM? Watch this YouTube short that features our technology: https://www.youtube.com/shorts/xKlqsv4nCao)
We revolutionized AFM technology by making them 1,000,000x smaller than traditional instruments.
Now we’re using our core technology to build AFMs for the semiconductor industry: delivering nanoscale measurement 10,000x to enable new chip making processes with less waste.
About the role
As Semiconductor Packaging Engineer at icspi, you will work on packaging technology to enable entirely new nanoscale imaging technology.
We are looking for a resourceful, hands-on engineer with a broad skill set. You will play a critical role in developing, integrating and optimizing semiconductor packaging to scale our unique micro-electro-mechanical systems (MEMS)-based AFM technology to drive industry-leading performance and capability.
Work includes the design and test of packaging technologies for our MEMS-based AFM devices, working with suppliers to execute on processes, driving continuous improvement in yield and reliability. You will own the packaging solution from concept through qualification.
The ideal candidate is a self-starter who uses first principles thinking and has deep expertise in semiconductor packaging.
What you'll do
- Work with team to explore, design and test end-to-end semiconductor packaging solutions for MEMS devices
- Design and conduct hands-on lab experiments end-to-end
- Lead supplier engagement, work with suppliers to develop processes and continuous improvement
- Travel up to 25%
Qualifications
- Bachelor’s Degree or higher in engineering (mechanical, electrical, nanotechnology, or engineering physics) or physics
- Hands-on experience in the cleanroom and with semiconductor packaging techniques (dicing, die attach, wire bond)
- Hands-on metrology experience (e.g., optical, SEM, interferometry)
- Knowledge of packaging materials, thermal management, and reliability testing
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively
Nice to have
- Multiple years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies
- Familiarity with MEMS and MEMS packaging
- Mechanical design, simulation and prototyping (3D printing, machine shop, etc.)
- Experience with supplier management
To apply
Send your CV and portfolio to [email protected] with the job title in the subject. Cover letter not necessary.
Working at icspi
We’re a hardware company that designs, manufactures and sells atomic force microscope systems.
Our lab and office are located in downtown Kitchener, Ontario, Canada.
