Careers
Semiconductor Packaging Engineer
icspi is building the future of nanoscale imaging.
We’ve revolutionized atomic force microscopy (AFM) by miniaturizing it by a factor of 1,000,000x compared to traditional systems: integrating all the components of an AFM onto a single CMOS chip, which we call microAFM.
Our core tech is field-proven and powers our desktop instruments that are used by scientists and engineers in over 40 countries.
Now we are using our core tech to solve throughput-resolution gaps in the semiconductor industry: catching nanoscale defects to enable new processes and prolong Moore’s Law.
Today, scanning a wafer with AFM would take about 70 years. By using thousands of microAFMs in parallel, we can scan a wafer in a matter of hours.
Build the future of nanoscale imaging with us.
(What’s AFM? Watch this YouTube short that features our technology: https://www.youtube.com/shorts/xKlqsv4nCao)
About the role
As Semiconductor Packaging Engineer at icspi, you will work on packaging technology to enable entirely new nanoscale imaging technology.
We are looking for a resourceful, hands-on engineer with a broad skill set. You will play a critical role in developing, integrating and optimizing semiconductor packaging to scale our unique micro-electro-mechanical systems (MEMS)-based AFM technology to drive industry-leading performance and capability.
Work includes the design and test of packaging technologies for our MEMS-based AFM devices, working with suppliers to execute on processes, and driving continuous improvement in yield and reliability. You will own the packaging solution from concept through qualification.
The ideal candidate is a self-starter who uses first principles thinking and has deep expertise in semiconductor packaging.
What you'll do
- Work with team to explore, design and test end-to-end semiconductor packaging solutions for MEMS devices
- Design and conduct hands-on lab experiments end-to-end
- Lead supplier engagement, work with suppliers to develop processes and continuous improvement
- Travel up to 25%
Qualifications
- Bachelor’s Degree or higher in engineering (mechanical, electrical, nanotechnology, or engineering physics) or physics
- Hands-on experience in the cleanroom and with semiconductor packaging techniques (dicing, die attach, wire bond)
- Hands-on metrology experience (e.g., optical, SEM, interferometry)
- Knowledge of packaging materials, thermal management, and reliability testing
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively
Nice to have
- Multiple years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies
- Familiarity with MEMS and MEMS packaging
- Mechanical design, simulation and prototyping (3D printing, machine shop, etc.)
- Experience with supplier management
To apply
Send your CV and portfolio to [email protected] with the job title in the subject. Cover letter not necessary.
Working at icspi
We’re a hardware company that designs, manufactures and sells atomic force microscope systems.
Our lab and office are located in downtown Kitchener, Ontario, Canada.
