News

Dallas, TX, May 30, 2025 – ICSPI, represented by Director of Operations David Morris, attended ECTC 2025 and is awarded 2nd place in the Student and Startup competition.

ECTC is the premiere event for semiconductor packaging – covering what’s next in advanced interconnect (including hybrid bonding), glass substrates, co-packaged optics, plus essential areas making these technologies work, like thermals, metrology and reliability. 

Earlier this year in collaboration with imec, ICSPI showed a world-first AFM system with 10 AFM scan heads that collected that sub-nanometer data across a hybrid bonding wafer 10x faster than is possible today.

The competition was exciting with an extremely close race for first place between Scrona Ltd. and ICSPI. The tie breaker went to Scrona, who took home the trophy and a first place prize package by Kiterocket and Yole Group.

We are grateful for the opportunity to put the spotlight on our massively parallel AFM technology, which is critical for measuring the copper pad recess and improving hybrid bonding yield.

About ICSPI

ICSPI is a leader in benchtop nanoscale imaging instruments, headquartered in Kitchener-Waterloo, Ontario, Canada. Its first product, the nGauge AFM, has reset the expectations for nanoscale imaging. ICSPI’s atomic force microscope systems are trusted by scientists, engineers and educators in over thirty countries to effortlessly collect nanoscale data with speed, precision and accuracy. With the addition of the Redux AFM to its product line, ICSPI is advancing its mission of expanding access to nanoscale measurement with powerful, automated and intuitive imaging tools.

To learn more about ICSPI and the Redux AFM, visit www.icspicorp.com